Page 8 - 3D Metal Printing Fall 2019
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  3D INDUSTRY NEWS
 AMUG Conference 2020 Registration Opens
The Additive Manufacturing Users Group (AMUG) has opened online registration for its 2020 Education & Training Conference, March 22-26, 2020, in Chicago, IL. The conference, now in its 32nd year, is a users’ event for owners and operators of industrial additive manufactur- ing (AM) technologies used for professional pur- poses and attracts users representing all levels of experience.
Building on the success of last year’s confer- ence, AMUG organizers look forward to deliver- ing a program with more training and hands-on experiences. For example, the Training Lab offers an engaging training environment where AM tools are the focal point of the information exchange. The conference agenda offers nearly 200 presentations and hands-on workshops and the AMUGexpo, with about140 participating companies, March 22 -23. In addition, the sixth annual Innovators Showcase features on-stage
interviews with industry trailblazers.
For details and registration, visit www.amug.com.
deposition (HWD) in AM.
Using hybrid multitasking HWD tech-
nology, the project looks to develop a closed-loop control system with the abili- ty to make on-the-fly adjustments according to sensor feedback during the HWD builds. Such in-process adjustabili- ty ensures the consistency, quality and reliability of HWD additive technology, especially for aerospace, automotive and die/mold industries.
Specific applications include the repair of turbine blades and other high- wear parts such as engine blocks, cylin- der heads, and molds and dies.
thyssenkrupp Becomes First 3D Printed Parts Company to Gain
DNV GL Approval
The DNV GL, an international accred- ited registrar and classification society headquartered in Hovik, Norway, has issued a certificate making the thyssenk- rupp Additive Manufacturing TechCenter in Singapore the world’s first producer of 3D printed parts for maritime applica- tions to obtain DNV GL manufacturer approval.
thyssenkrupp Marine Systems, Dussel- dorf, Germany, works closely with inter- national customers on the integration of AM parts on ships and submarines.
The approval covers the 3D printing and processing of austenitic stainless steel parts.
   EOAT Provider OnRobot Opens R&D Office in CA
OnRobot, provider of end-of-arm tool- ing (EOAT) for collaborative-robot appli- cations, has opened its first location dedi- cated to R&D in the United States. The Los Angeles (Culver City), CA, office com- prises 6000 sq. ft. and houses engineers, researchers and local staff tasked with developing new products.
Last year marked OnRobot’s first foray into the Los Angeles area, as it acquired Perception Robotics and its Gecko Grip- per technology, and developed it for commercial launch. The tactile Gecko Gripper uses millions of micro-scaled fib- rillar stalks that adhere to a surface the same way that lizards climb, enabling it to pick up porous and delicate objects.
The collaborative-robot market now is the fastest growing segment of industrial automation, expected to jump 10-fold to 34 percent of all industrial robot sales by 2025, according to the International Federation of Robotics.
Mazak and Oak Ridge Partner to Further Wire Additive R&D
Mazak Corp., a Florence, KY-based provider of machining solutions and Oak Ridge National Laboratory’s manu- facturing demonstration center in Oak Ridge, TN, have announced a coopera- tive research and development agree- ment. Working on behalf of the U.S. Department of Energy, ORNL and Mazak will advance the use of hot wire
 6 | 3D METAL PRINTING • FALL 2019
3DMPmag.com
AM System Makes Possible
Secured Electronics for Defense Agencies
Two U.S. defense and security agencies have bought a DragonFly system by Israiel- based Nano Dimension, Ltd., for AM of electronics. Nano Dimension, a certified U.S. Department of Defense vendor, helps defense companies meet strict timelines, pro- duce fully functional electronic circuitry and protect security-sensitive and proprietary designs.
The system, built to print multilayer fully functional complex circuitry, enables com- panies to lessen the risk of intellectual-property theft, streamline productivity by bring- ing additive manufacturing inhouse, consolidate electronic components and reduce their size and weight, and simplify multipiece assemblies.








































































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